THERMALTAKE TG-50 Thermal Compound
| Category | Specification Details |
|---|---|
| Product Name | Thermaltake TG-50 Thermal Compound |
| Part Number (P/N) | CL-O024-GROSGM-A |
| Thermal Conductivity | 8.0 W/m-k (Includes Diamond Powder) |
| Thermal Impedance | 0.035°C -in²/W |
| Viscosity | 47 Pa-s |
| Density | 2.9 g/cm³ |
| Net Weight | 4g |
| Color | Gray |
| Safety Features | Non-electrically conductive (Safe for CPU/GPU) |
| Application Kit | Honeycomb stencil and spreader included for mess-free application |
| Sustainability | Formulated to resist dry-out and cracking for long-term use |
$2.58
Original: $8.59
-70%THERMALTAKE TG-50 Thermal Compound—
$8.59
$2.58Product Information
Product Information
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Description
| Category | Specification Details |
|---|---|
| Product Name | Thermaltake TG-50 Thermal Compound |
| Part Number (P/N) | CL-O024-GROSGM-A |
| Thermal Conductivity | 8.0 W/m-k (Includes Diamond Powder) |
| Thermal Impedance | 0.035°C -in²/W |
| Viscosity | 47 Pa-s |
| Density | 2.9 g/cm³ |
| Net Weight | 4g |
| Color | Gray |
| Safety Features | Non-electrically conductive (Safe for CPU/GPU) |
| Application Kit | Honeycomb stencil and spreader included for mess-free application |
| Sustainability | Formulated to resist dry-out and cracking for long-term use |
